CY7C68013A EOL: Specs, Part List & Pin-to-Pin Replacements (CBM9002A)

Meet Infineon CY7C68013A (EZ-USB™ FX2LP): the classic USB2.0 data pump

CY7C68013A sits in Infineon’s (formerly Cypress) EZ-USB™ FX2LP family – a USB 2.0 High-Speed (480 Mbps) peripheral controller with an enhanced 8051 core, 16 KB on-chip RAM, and the famous GPIF/Slave-FIFO parallel interface. Engineers loved it because it made custom USB devices and parallel-to-USB bridges fast to implement and predictable to ship – from logic analyzers to industrial cameras and DAQ tools. These fundamentals are well documented in the official datasheet and TRM.

Why it aged so well

• RAM-download firmware (or EEPROM boot) – iterate quickly without re-flashing.

• GPIF/Slave-FIFO – deterministic handshakes to sensors/ASICs/FPGA, ideal for streaming data.

• Mature ecosystem – countless reference designs and community tooling.

The EOL: dates, reason, and what it covers

Infineon’s Product Discontinuation PD_314_24 announces:

• Last Order Date (LOD): March 15, 2025

• Last Delivery Date (LDD): September 15, 2025

• Reason: No fabrication support from SkyWater; no alternative to manufacture
  The PD file enumerates many affected OPNs across the FX2LP family and lists “NEW (replacement)” pointers (e.g., to CYUSB2315/2316 FX2G3 or the FX2G3 kit).

In parallel, individual product pages (e.g., CY7C68013A-56LTXC / CY7C68013A-56PVXI / CY7C68013A-128AXC) display END OF LIFE banners linking to datasheets and replacement suggestions.

CY7C68013A model snapshot & core parameters

Use this for quick BOM decoding and feasibility checks.

Common packages

• SSOP-56 (e.g., CY7C68013A-56PVXC / CY7C68013A-56PVXI)

• QFN-56 (CY7C68013A-56LTXC / CY7C68013A-56LTXI)

• VFBGA-56 (CY7C68013A-56BAXC)

• TQFP-100 / TQFP-128 (CY7C68013A-100AXC / CY7C68013A-128AXC / industrial -AXI variants)

Family-level specs (high-level)

• USB 2.0 HS/FS device, enhanced 8051 at 12/24/48 MHz, 16 KB RAM, GPIF/Slave-FIFO, I²C master, UART, EEPROM boot or RAM download.

Representative OPNs seen in the PD and site pages

• CY7C68013A-56PVXC / CY7C68013A-56PVXCT / CY7C68013A-56PVXI

• CY7C68013A-56LTXC / CY7C68013A-56LTXCT / CY7C68013A-56LTXI

• CY7C68013A-56BAXC / CY7C68013A-56BAXCT

• CY7C68013A-100AXC / CY7C68013A-100AXI

• CY7C68013A-128AXC / CY7C68013A-128AXI

Where it’s used (and why the EOL hurts)

Use cases: logic/protocol analyzers, video capture and industrial cameras (DVP/parallel), programmers/debug probes, DAQ/oscilloscope bridges, scanners, smart card readers. Open-hardware and tool ecosystems (e.g., sigrok/PulseView) cemented its status as the “default” USB2.0 data bridge.

Pain points now

• Board lock-in: many designs hard-coded to FX2LP pinouts, timings, and descriptors.

• Cost of change: revising PCB/firmware + recertification (USB-IF/EMC/industry standards).

• Supply risk: sunset buying windows and distributor dry-ups around LOD/LDD.

Three replacement strategies

1. Pin-to-Pin (P2P) drop-in — minimal disruption for in-production hardware.

2. Family successor — Infineon FX2G3 (CYUSB2315/2316) as the official path forward.

3. Capability upgrade — jump to USB 3.x controllers for higher throughput and interfaces.

We break each down below.

Zero-PCB-change first: CBM9002A (Corebai) as a practical P2P

If your No.1 goal is to stop the bleeding without touching the PCB, CBM9002A is the most direct candidate many design/ops teams are evaluating.

What it is

• Enhanced 8051 with 48/24/12 MHz clocking; 4 clocks per instruction

• USB 2.0 HS/FS device; 7 endpoints (EP0, EP1IN, EP1OUT, EP2, EP4, EP6, EP8)

• On-chip RAM 16 KB; Slave-FIFO/Programmable interface (PIF) akin to GPIF

• Packages: SSOP-56 / QFN-56 / VFBGA-56 / LQFP-100

• Industrial temp options: -40~105 °C

• Vendor docs state USB-IF compatibility test passed (for HS/FS).
  All of the above are spelled out in the CBM9002A operation/datasheet.

Why it’s attractive for P2P

• Footprint coverage aligns with the most common FX2LP form factors.

• The Corebai selection guide provides OPN-to-OPN mapping—for example:

  • CBM9002A-56SCG ↔ CY7C68013A-56PVXC (SSOP-56)

  • CBM9002A-56LCG ↔ CY7C68013A-56LTXC (QFN-56)

  • CBM9002A-56BCG ↔ CY7C68013A-56BAXC (VFBGA-56)

  • CBM9002A-100TIG ↔ CY7C68013A-100AXI (TQFP-100, industrial)
    These tables are explicitly published by the vendor to streamline P2P selection.

Reality check: P2P ≠ “drop it in and ship”

• Power/clock/reset: validate 3.3 V rails/decoupling, 24 MHz XO load, POR thresholds, suspend/resume current paths.

• USB descriptors & endpoints: re-confirm EP config (especially EP2/EP6 bulk pipes) and FIFO timings.

• Boot flow: keep your RAM download flow for dev, EEPROM boot for production.

• Compliance & reliability: if you hold USB-IF/EMC or industry certs (e.g., industrial/medical), plan to re-validate.

In the wild: CBM9002A already appears as a drop-in on several hobbyist and low-cost logic analyzer boards originally designed for FX2LP—evidence the ecosystem sees it as a pragmatic P2P stop-gap.

Family successor: FX2G3 (CYUSB2315/2316)

If you prefer staying within the official Infineon ecosystem, FX2G3 is positioned as FX2LP’s successor for USB 2.0 designs. Key points from the product brief and resources:

• USB 2.0 HS (480 Mbps) controller family.

• Up to 32 endpoints (16 IN + 16 OUT) configurable as bulk/iso/interrupt—more flexibility than FX2LP for complex pipelines.

• Migration resources: knowledge-base migration guide, DVK/BSP on GitHub, and examples showing endpoint pair setups.

Trade-off: expect some rework compared to true P2P; however, you get an Infineon-supported product line and modern collateral.

Capability upgrades: FX3 (5 Gbps) or WCH CH569 (USB3 + rich IO)

When bandwidth/IO trump compatibility:

• FX3: Infineon USB 3.0 (5 Gbps) controller with GPIF II and solid SDK support—great for high-speed imaging/DAQ.

• CH569: WCH’s RISC-V SoC with USB 3.0, USB 2.0, Gigabit Ethernet, SerDes, HSPI, DVP—a very capable bridge SoC (docs and open examples abound).
  Note: both routes require PCB + firmware redesign and certification re-work—best for next-gen products.

Migration checklist (keep this as your internal SOP)

Hardware

• Pin compatibility: if choosing CBM9002A, pick the OPN that maps 1:1 to your CY7C68013A package; verify USB D+/D−, GPIF/FIFO lines, EEPROM pins, pull-ups/downs.

• Clock/power/reset: confirm 24 MHz XO spec and 3.3 V domain headroom under HS load; check suspend current vs design.

• Signal integrity/ESD: keep 90 Ω differential (USB), ESD diodes, reference plane return paths, and connector mating.

Firmware & descriptors

• Boot path: RAM download for dev, EEPROM for field; lock a signed build pipeline.

• Endpoints/FIFO timing: re-tune bulk pipes (EP2/EP6) and verify GPIF/Slave-FIFO Waveforms under worst-case clocks.

• Drivers: WinUSB/libusb are common denominators; FX2G3 uses modern stacks/examples.

Validation

• USB-IF HS eye/compliance, EMC, ESD, and temp/aging (-40~105 °C if you claim industrial).

• Use-case stress: max throughput, hot-plug cycles, suspend/resume loops, power dips, and long-soak streaming.

Side-by-side: pick by intent

Buying & supply-chain playbook

• Anchor on the EOL dates: LOD Mar 15, 2025; LDD Sep 15, 2025. Plan last-time-buys and bridge inventory accordingly.

• Dual-track: deploy P2P (CBM9002A) on current builds to stabilize shipments, while migrating to FX2G3 in parallel to reduce long-term risk.

• Qualify your channel: prefer franchised/traceable distributors; spot pricing and “one-day-a-price” behaviors surge late in EOL cycles.

• Stage validation: EVT→DVT with small, time-boxed lots—only scale after compliance and soak tests pass.

FAQ About Infineon CY7C68013A MCU

Q1. When exactly is CY7C68013A going EOL?
A. Infineon’s PD PD_314_24 states Last Order Date: Mar 15, 2025 and Last Delivery Date: Sep 15, 2025, with the reason “no fabrication support from SkyWater.”

Q2. Is there an official successor?
A. Yes: EZ-USB™ FX2G3 (CYUSB2315/2316), with a migration guide, product brief, and DVK/BSP examples.

Q3. Is there a pin-to-pin drop-in so I don’t change my PCB?
A. CBM9002A is marketed exactly for that purpose, including SSOP-56 / QFN-56 / VFBGA-56 / LQFP-100 options and OPN-to-OPN mapping against common CY7C68013A parts. Validate power/clock/USB descriptors and run compliance tests before scaling.

Q4. Does CBM9002A match FX2LP’s performance envelope?
A. On paper: enhanced 8051 @48 MHz, 16 KB RAM, USB 2.0 HS/FS, 7 endpoints, FIFO/PIF—very close to FX2LP use patterns; vendor docs also mention USB-IF compatibility testing. Still, you must regression-test under your throughput, timing, and environmental constraints.

Q5. I actually need more bandwidth. What then?
A. Consider FX3 (USB 3.0 @ 5 Gbps) or CH569 (USB 3.0 + rich IO)—these are not P2P and require hardware + firmware redesign, but they unlock new performance tiers.

The controller that made custom USB devices simple

If your product ever needed to stream parallel data into a PC reliably—be it pixels, samples, or protocol traces—the FX2LP family was a natural fit. CY7C68013A combined an enhanced 8051 with enough on-chip RAM and a GPIF/Slave-FIFO that “just worked.” Firmware could be downloaded over USB during development or booted from EEPROM in production, drastically shrinking iteration loops and BOM complexity. Decades of kits, examples, and community tooling made it the default bridge for countless embedded projects.

Why EOL now?

Process nodes, IP, and fab relationships don’t last forever. The PD makes it explicit: fabrication support ended at SkyWater; without an alternate manufacturing path, Infineon is discontinuing the affected lines, with clear LOD/LDD dates to give the market runway. For teams still shipping or supporting FX2LP designs, the priority is continuity—keeping shipments flowing while avoiding brittle stopgaps.

Two-step survival strategy

Step 1: Stabilize with a P2P device so you don’t change the PCB or SMT programs mid-production.
Step 2: De-risk by planning a family migration (FX2G3) or next-gen upgrade (FX3/CH569) once schedules and budgets allow.

CBM9002A is compelling for Step 1 because it checks the right boxes (HS/FS USB2.0, 8051@48 MHz, 16 KB RAM, FIFO/PIF) and ships in matching packages—with an explicit OPN-to-OPN table mapping common CY7C68013A part numbers to the corresponding CBM9002A choices. That cuts discovery time for buyers and layout engineers to near zero.

For Step 2, FX2G3 keeps you inside the Infineon ecosystem with more endpoints and up-to-date collateral (migration guide, examples, DVK/BSP). It’s not a literal P2P swap, but it’s a lower-risk architectural move than jumping straight to USB 3.x.

If your roadmap demands bandwidth or additional high-speed interfaces, FX3 or CH569 change the game—at the cost of redesign. They’re ideal when you’re timing a platform refresh or launching a new model that can absorb validation cycles.

Reference

• Discontinuation notice with dates and SkyWater reason (PD_314_24, includes OPN lists and “NEW” pointers).

• EOL product pages for representative CY7C68013A OPNs (END OF LIFE status). 

• FX2LP datasheet/TRM for architecture, endpoints, GPIF/Slave-FIFO, firmware modes. 

• FX2G3 product overview/brief + migration resources & BSP/examples.

• CBM9002A datasheet (features, endpoints, packages, industrial temp, USB-IF test claim).

• Corebai selection guide (explicit OPN-to-OPN mapping for P2P).

• FX3 (USB 5 Gbps) controller overview and SDK

• CH569 (USB 3.0 RISC-V) datasheet & resources.