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- 8-Bit Serial-to-Parallel Conversion – Efficiently expands microcontroller GPIOs.
- Tri-State Outputs – Allows multiple devices on the same bus (high-impedance when disabled).
- Wide Voltage Range (2V–6V) – Works with 3.3V and 5V systems.
- ±0.5% Initial Voltage Accuracy (B-grade) – Superior precision for critical applications.
- Wide Adjustable Range (2.495V to 36V) – Flexible for diverse circuit requirements.
- 100mA Shunt Current Capacity – Strong handling for medium-power regulation.
- 92 PPM/°C Low Temp Drift – Ensures stability across industrial & automotive conditions.
The TPS40200DR from Texas Instruments is a versatile, efficient buck controller well-suited for industrial, automotive, and consumer power supplies. With its wide input range, adjustable output, and robust SOIC-8 packaging, it simplifies high-performance DC-DC conversion while maintaining TI??s hallmark reliability.
- Military temperature range (-55°C to +125°C)
- Radiation-hardened design (100kRad TID)
- Enhanced ESD protection (2000V HBM / 1000V CDM)
- Ultra-Low Bias Current: ±4pA enables direct interface with piezoelectric and capacitive sensors.
- Wide Gain Range: Adjustable from 1V/V to 10,000V/V with ±0.001% nonlinearity error.
- Robust Protection: Withstands ±40V input overload without external components.
- Ultra-Low Distortion (<0.00003% THD+N)
- Blazing-Fast 1900V/µs Slew Rate
- Low Noise (2.7nV/√Hz) & Wide Bandwidth (132MHz)
- Industrial Temperature Range (-40°C to +85°C) for harsh environment operation
- Higher Output Drive Capacity (±6mA at 5V) vs basic 74HC logic family
- Robust ESD Protection (2000V HBM) for improved field reliability
- Through-hole DIP package - Ideal for prototyping and repairs
- 15 LSTTL load drive capability - Strong output for direct loads
- Cascadable serial output - Expand to unlimited bits
- 60ns Access Time – Faster performance than 70ns variants for demanding applications.
- 256K x 16-Bit Architecture – Efficient 16-bit memory handling for older systems.
- Wider Temperature Range: Operates reliably from 0°C to 70°C.
- 70ns Access Time – Optimized for fast read/write operations in high-performance systems.
- 256K x 16-Bit Organization – Balances memory density with efficient data handling.
- 5V Single Supply Voltage – Compatible with legacy industrial and embedded devices.
The Xilinx Virtex-7 VC707 Evaluation Kit features the XC7VX485T FPGA with 40Gb/s serial bandwidth, PCIe Gen2x8, DDR3, and FMC expansion. Ideal for high-performance DSP, networking, and embedded development.
Key Features:
✅ XC7VX485T-2FFG1761C FPGA – High-speed GTX transceivers (16Gbps) ✅ 1GB DDR3 + PCIe Gen2x8 – Advanced memory & interface support ✅ FMC HPC Connectors – Expand with mezzanine cards for custom I/O
The Xilinx XC2C256-6FTG256C is a low-power, high-performance CPLD with 256 macrocells, 5.7ns pin-to-pin delays, and multi-voltage I/O (1.5V–3.3V). Ideal for battery-powered and high-speed logic designs.
Key Features:
✅ Ultra-Low Power – 13μA quiescent current, DataGATE for dynamic power reduction ✅ High-Speed Logic – 5.7ns pin-to-pin delay, DualEDGE flip-flops for 2x efficiency ✅ Flexible I/O Banking – Supports LVCMOS, LVTTL, SSTL, HSTL (1.5V–3.3V)
The Xilinx XC2VP4-5FGG256I FPGA features 4 RocketIO transceivers, a PowerPC CPU core, and 6,768 logic cells—ideal for 5G, AI, and industrial applications. View specs, pricing, and alternatives at FPGAkey.
Key Features:
✅ Multi-Gigabit Transceivers: 4 RocketIO for high-speed serial comms (up to 3.125Gbps) ✅ Integrated PowerPC 405 CPU: RISC-based embedded processing ✅ High-Density Logic: 6,768 cells, 752 CLBs, and 516Kb RAM for complex designs
The Xilinx XC3S1500-4FGG456C FPGA delivers 1.5M logic gates, 316 I/O, and DSP slices—ideal for industrial, automotive, and video processing. View datasheets, pricing, and alternatives.
Key Features:
✅ High Logic Density – 1.5M gates, 1,542 logic cells ✅ Rich I/O Options – 316 user I/O, supports LVCMOS, LVTTL, HSTL, SSTL ✅ DSP & RAM Resources – 1,728Kb BRAM, embedded multipliers
The Xilinx XC3S200A-4FTG256I FPGA offers 200K logic gates, 128 I/O pins, and ultra-low power (0.35mW) - ideal for aerospace, automotive & IoT. Supports VHDL/Verilog.
Key Features
✅ Ultra-Low Power (0.35mW Static) – 90nm process, ideal for battery-powered & rugged applications. ✅ High-Speed I/O & DSP Support – 667MHz operation with embedded multipliers for signal processing. ✅ Multi-Voltage Compatibility (1.2V–3.3V) – Flexible I/O standards (LVCMOS, LVTTL, HSTL, SSTL).
The Xilinx XC5VLX30T-1FF665I FPGA delivers 30K logic cells, 3.75Gbps GTP transceivers, and 550MHz DSP slices—ideal for 5G, aerospace, and high-performance computing. Supports PCIe & Ethernet MAC.
Key Features
✅ 3.75Gbps RocketIO GTP Transceivers – High-speed serial links for PCIe, SATA, and 5G backhaul. ✅ 550MHz DSP48E Slices – 25×18 multipliers + 48-bit accumulators for real-time signal processing. ✅ Advanced 65nm Low-Power Design – 1V core voltage with integrated thermal/power monitoring.
The Xilinx XC6VLX130T-1FFG1156C (Virtex-6 LXT) FPGA features 131,072 logic cells, 6.5Gbps GTX transceivers, and hardened PCIe/Ethernet IP for high-bandwidth applications in networking, aerospace, and industrial automation.
Key Features
✅ 6.5Gbps RocketIO GTX Transceivers – Supports PCIe Gen2, SATA, 10G Ethernet, and CPRI. ✅ High-Capacity Logic Fabric – 131K logic cells with 6-input LUTs for complex designs. ✅ Power-Optimized 40nm Architecture – 1.0V core voltage with triple-oxide technology for reduced leakage.
The Xilinx XC6VLX240T-2FFG784I (Virtex®-6 LXT) FPGA delivers 241,152 logic cells, 15.3Mb RAM, and 6.6Gbps GTX transceivers for high-bandwidth applications in 5G, AI, and industrial systems. Supports PCIe, Ethernet, and rugged -40°C to 100°C operation.
Key Features
✅ High-Density Logic Fabric: 241K logic cells with 6-input LUTs for complex designs. ✅ Ultra-Fast Serial Connectivity: 6.6Gbps GTX transceivers (PCIe Gen2/3, 10G Ethernet). ✅ Extended Temperature Range: -40°C to +100°C for harsh environments.
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DSBGA-8 footprint for the smallest prototypes and z-height budgets.
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Full MSPM0C1104 feature set (24-MHz M0+, 12-bit ADC, UART/I²C/SPI) in a minuscule package.
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Explicit X-device status to de-risk production—prototype now, change package later.