MSPM0C1104SDSGR Texas Instruments MSPM0C1104SDSGR Microcontroller (WSON-8)

MSPM0C1104SDSGR – 24-MHz M0+ MCU with 12-bit ADC and ultra-low power in an 8-pin WSON package

MSPM0C1104SDSGR brings the MSPM0C110x essentials to a slim 8-pin WSON (DSG) package that’s friendly to high-volume assembly and offers excellent board contact for thermal paths. Even with the minimal pin count, you still get a 24-MHz Arm® Cortex®-M0+, 16KB Flash / 1KB SRAM, a 12-bit ADC up to 1.5 Msps, and the foundational serial interfaces (UART, I²C (FM+), SPI). The trimmed internal SYSOSC enables crystal-less 24 MHz in many designs, shrinking BOM and height for wearables, tags, and ultra-compact sensors.

Use SDSGR when you need more thermal and mechanical robustness than SOT-23 in a similarly tiny footprint—think sealed enclosures, flex PCBs, or devices that see frequent handling or temperature swings.

Highlights

• Slim, assembly-friendly footprint: WSON-8 (DSG) with large thermal/ground pad for heat spreading and mechanical stability.

• Mixed-signal in tiny spaces: 12-bit ADC (to 1.5 Msps) plus internal 1.4 V / 2.5 V references for stable measurements.

• Right-sized performance: 24-MHz M0+, 16KB Flash / 1KB SRAM for compact control loops and sensor stacks.

• Crystal-less operation: internal SYSOSC often eliminates the need for an external clock.

• Ultra-low power: typical ~87 µA/MHz run, ~5 µA standby, ~200 nA shutdown for battery-first designs.

• Package-aware flexibility: the family supports up to 18 GPIO—map what you need within the 8-pin budget.

Specifications

Applications

• Ultra-slim wearables, tags, badges — thin stackup, robust assembly, long battery life.

• LED effects & drivers — small PWM control for indicators, beacons, or light bars.

• Thermally aware compact sensors — leverage the exposed pad for thermal coupling to the measured medium or chassis.

• Tiny utility monitors — voltage/temperature/pressure sensing with UART/I²C reporting.

• Sealed enclosures & flex PCBs — low profile, good heat path, and rugged attach.

WSON-specific design notes

• Exposed pad = ground & thermal path: tie the center pad to GND with a stitched thermal land and via array (e.g., 4–9 microvias) into the ground plane. Keep short returns for ADC/VREF nodes.

• Stencil & reflow: use a window-pane stencil (e.g., 50–70% area coverage) to avoid excessive voiding and float. Follow TI’s reflow profile guidance for WSON.

• Keep-out for analog: route sensitive analog traces away from pad edges; reserve a quiet ground pour around ADC input pins.

• Mechanical robustness: WSON distributes stress better than SOT-23 in flex/portable builds; consider fillets/land extensions if your CM recommends them for visual inspection.

• Thermal coupling tricks: when measuring temperature, place a copper “thermal tongue” from the exposed pad toward the sensing site (or chassis) to improve tracking.

Pin-budget strategy (8-pin reality check)

• Pick one primary bus (often I²C for sensor farms).

• Share pins via muxing for UART debug during bring-up, then reassign to GPIO/PWM in production.

• Prioritize ADC channels early—shortlist which analog nodes truly need precision vs. can be time-multiplexed or derived.

• PWM on a diet: choose a timer topology that supports your LED/motor needs with minimal pins.

Power strategy

• Event-driven firmware: sleep in STANDBY, wake on GPIO/RTC/ADC threshold.

• Shipping/storage mode: use SHUTDOWN (~200 nA) to preserve coin cells on the shelf.

• Run-current budgeting: ~87 µA/MHz → about ~2.1 mA @ 24 MHz plus peripherals; gate clocks aggressively.

Development & production

• Software bring-up: start with a minimal UART or I²C template; add ADC and PWM once comms are stable.

• Test header: expose VCC/GND/DEBUG (UART or SWD) via pads or a pogo-pin fixture.

• Scalability: if you outgrow the 8-pin I/O, migrate within MSPM0C110x to larger packages with high code reuse.

Positioning summary

MSPM0C1104SDSGR is the pick when you need real mixed-signal capability, credible serial I/O, and ultra-low power in a slim, thermally capable 8-pin package. It’s a practical bridge between tiny SOT solutions and larger QFN footprints—ideal for compact, battery-powered products that still need fast ADC and dependable assembly.