Showing 2161–2190 of 2509 results
- Fast Switching Speed
Features a 4 ns reverse recovery time, making it suitable for high-speed signal switching and pulse applications. - 100 V / 200 mA Performance
Offers 100 V repetitive reverse voltage and 200 mA average rectified forward current for reliable small-signal and general-purpose circuit use. - DO-35 Through-Hole Package
Comes in a DO-35 axial through-hole package, ideal for traditional PCB assembly, prototyping, and maintenance applications.
- General-purpose NPN transistor for switching and amplification
- 40 V collector-emitter voltage with 200 mA continuous collector current
- 300 MHz transition frequency in a compact through-hole TO-92-3 package
- AEC?Q101 qualified - Meets automotive-grade component reliability standards
- PPAP capable - Supports Production Part Approval Process documentation
- RoHS compliant construction - Eliminates hazardous substances (Pb, Hg, Cd, etc.)
- Halogen/BFR free - Environmentally friendly material composition
- Ultra-Low Quiescent Current: 50nA in Low Power Mode (LPM), 95µA in Active Mode.
- Dual-Mode Operation: Toggle between 80mA Active Mode and 5mA LPM via ECO pin.
- Output Voltage Offset: Factory-set 50mV drop in LPM for additional power savings.
- Industrial-grade durability with 5-year warranty (when paired with PLUGTRAB SEC surge protection)
- Power Boost technology for 150% power reserve (5 seconds) to handle high inrush currents
- Preventive function monitoring detects faults before downtime occurs
- Slim-line design (62.5mm wide) optimizes control cabinet space
- Precision 50 Ohm Performance – RG-58C/U coaxial cable ensures consistent impedance and signal integrity for RF and test applications
- High-Quality BNC Connectors – Straight BNC male connectors with gold-plated center contacts and tarnish-resistant brass bodies
- Durable & UL Rated – PTFE dielectric, black jacket, and rated for operating temperatures up to +80 °C
- PWM-managed thermals – Temperature-controlled fan plus adhesive heatsink sustain performance under continuous load.
- Tool-free access – Snap-fit assembly, removable lid, and a tidy breakout slot for cables and GPIO make rapid iteration easy.
- Expansion ready – Stackable mounting and HAT-on-case support (with standoffs and header extender) streamline clusters and add-on boards.
- Breakthrough Compute & Graphics — 2.4 GHz quad-core Cortex-A76 with VideoCore VII (OpenGL ES 3.1 / Vulkan 1.2) drives dual 4Kp60 displays and smooth desktop/multimedia performance with ~2–3× CPU uplift vs. Pi 4.
- Next-Gen I/O with RP1 — Doubled per-port USB 3.0 (5 Gbps), dual 4-lane MIPI for dual cameras/displays, faster microSD SDR104, plus PCIe 2.0 x1 (via M.2 HAT) for NVMe SSD expansion.
- Deployment-Ready Design — On-board power button + PMIC, RTC header, USB-C PD (27 W recommended), Gigabit Ethernet with PoE+ HAT option, and a rich ecosystem (premium case with fan, Active Cooler, M.2/PoE+ HATs).
- Dual-core performance with ample SRAM – Two M0+ cores up to 133 MHz and 264 kB multi-bank SRAM keep control loops, UI, and I/O running smoothly in parallel.
- Programmable I/O (PIO) – Two PIO blocks (eight state machines) provide cycle-accurate pin control to emulate or extend peripherals like UART, video, or bespoke serial protocols—without extra ICs.
- Rich connectivity including USB 1.1 – Integrated full-speed USB with device/host modes, two each of UART/SPI/I²C, 16 PWM channels, 12-bit ADC, and 30 GPIO unlock a wide array of products with minimal components.
- Dual-Core, Dual-Architecture: Choose between Arm Cortex-M33 or RISC-V cores (both at 150MHz).
- Advanced Security: TrustZone, SHA-256 accelerator, OTP key storage, and glitch detection for tamper resistance.
- Rich I/O Capabilities: 48 GPIOs, 12 PIO state machines, and support for 16MB external flash/PSRAM.
- Onboard Memory: 520KB SRAM + 2MB stacked flash (RP2354B variant).
- Comprehensive Peripherals: USB 1.1 Host/Device, 24 PWM channels, 8 ADC inputs, and more.
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Quad-core Cortex-A55 up to 2.0 GHz for responsive, power-efficient embedded compute.
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1 TOPS NPU + Mali-G52 GPU for edge AI and modern graphics/compute APIs.
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4Kp60 decode, 1080p60 encode, and multi-display support for rich media scenarios.
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Quad-core Cortex-A55 up to 2.0 GHz for responsive, power-efficient embedded compute.
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1 TOPS NPU + Mali-G52 GPU for edge AI and modern graphics/compute APIs.
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4Kp60 decode, 1080p60 encode, and multi-display support for rich media scenarios.
- 8-core 8 nm CPU with 6 TOPS NPU: Flagship compute and AI acceleration for demanding edge workloads.
- 8K-class multimedia engine: Decode 8K60, encode 8K30, and drive multi-display setups up to 8K@60.
- Rich, modern I/O: PCIe 3.0, USB 3.1, SATA 3.0, GbE, and flexible camera/display interfaces.
- 6 TOPS on-chip NPU for private, low-latency AI at the edge.
- 8K60 decode + 8K30 encode for premium playback, recording, and signage.
- Dual 48MP ISP with HDR/3DNR for multi-camera vision systems.
- Compact U.FL to U.FL Connectivity
Designed with U.FL (UMCC) connectors on both ends, this cable assembly is ideal for compact RF modules, embedded systems, and space-constrained internal connections. - 100 Ohm Shielded 28 AWG Twinax Cable
Built with 28 AWG shielded twinax construction and 100 Ohm impedance, it helps maintain reliable signal integrity for high-frequency and controlled-impedance applications. - 11-Inch Cable Length for Flexible Routing
With an 11.00" (279.40 mm) overall length, this assembly provides a practical balance of routing flexibility and compact integration for OEM and industrial designs.
- 10 A DC made easy – Drop-in Grove module with ≈264 mV/A scale; read with any ADC.
- Low loss, high fidelity – ~1.2 mΩ primary path and differential Hall architecture for low error and minimal heating.
- Tune your noise – 120 kHz default bandwidth; add a capacitor on FILTER to boost resolution when needed.
- High-Speed Data Transfer up to 3200MT/s
Ensures fast data access and high bandwidth performance for servers, PCs, and networking applications. - Low Power Operation at 1.2V
Reduces overall system power consumption and heat generation, ideal for energy-efficient designs. - Compact FBGA-78 Package for Surface Mount Applications
Enables high-density PCB layouts and reliable SMT assembly in space-constrained systems. - Commercial Temperature Range from 0°C to 85°C
Provides stable and reliable operation in standard commercial and embedded environments.
- High-Performance DDR5-5600 Memory – Advanced DDR5 technology with a blazing 5600 MT/s speed for superior bandwidth and system responsiveness.
- Large 64 GB Capacity – Ample memory for servers and data-intensive applications, supporting multitasking and high workloads.
- ECC Registered (RDIMM) – Built-in error correction and registered architecture for improved stability, integrity, and reliability in mission-critical systems.
- Low Voltage & Dual Rank Design – Efficient 1.1 V operation and dual rank x4 organization for optimized performance and reduced energy usage.
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Heavy-duty 30 A rating with SPST-NO (1 Form A) contacts for mains switching up to 277 VAC.
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12 VDC non-latching coil with ~155 Ω coil resistance and ~77 mA coil current for straightforward drive from low-voltage control electronics.
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Sealed, PCB-mount package using solder-pin (F) terminals; compact 29 × 24.1 × 17.3 mm footprint; AgSnO contacts; RoHS compliant.
- High switching capability in a small body – compact PCB footprint yet supports up to 15 A @ 250 VAC (series rating), ideal for motors, compressors, and heaters.
- 5 V non-polarized coil, SPDT versatility – simple drive from logic-level transistors or drivers; route COM to NO/NC for fail-safe behavior.
- Sealed, process-friendly design – sealed (S) enclosure helps with dust/moisture ingress and allows standard cleaning processes after soldering.
- Industrial-Grade Robustness – Operates at 125°C junction temperature with ESD >4kV
- Hardware Crypto – 96-bit UID for secure boot/authentication
- Single-Cycle I/O – Bit-banding accelerates GPIO toggling (<15 ns pulse width)
