MSPM0C1104SRUKR MSPM0C1104SRUKR – Low-profile, high-I/O 24-MHz MCU in WQFN-20 with exposed pad

Texas Instruments MSPM0C1104SRUKR Microcontroller (WQFN-20) Overview

MSPM0C1104SRUKR packages TI’s MSPM0C110x mixed-signal feature set in a 20-pin WQFN (RUK) with an exposed thermal/ground pad, delivering maximum I/O density in the lowest z-height of the family. Compared with leaded SOT/VSSOP, WQFN minimizes loop inductance, improves ground impedance for the ADC and timers, and enables tighter, denser layouts—ideal for slim modules, stacked boards, and space-constrained enclosures.

You still get the core family features: 24-MHz Arm® Cortex®-M0+, 16KB Flash / 1KB SRAM, 12-bit ADC up to 1.5 Msps (ENOB >10 bits typical), UART / I²C (FM+) / SPI, and ultra-low-power modes with fast wake. The exposed pad gives you a robust thermal and EMI return plane, letting this tiny MCU punch above its size in mixed-signal performance.

Highlights (why choose WQFN-20)

• Ultra-low profile, high I/O: smallest z-height with broad pin access for multi-sensor, multi-PWM, or dual-bus designs.

• Exposed-pad advantage: low-impedance ground for ADC accuracy, PWM edge control, and EMI containment.

• Cleaner high-speed routing: short, symmetric traces benefit SPI up to ≤12 Mbps and time-critical control loops.

• Dense, manufacturable layouts: fine-pitch, leadless footprint enables compact modules and stacked daughtercards.

• Family consistency: same silicon and software as other MSPM0C1104 packages; migrate by I/O needs, not by codebase.

Specifications

Applications

• Space-limited control boards with strict z-height — thermostat PCBs, sensor tiles, stacked mezzanines.

• Sensor hubs & multi-PWM lighting engines — stable ADC ground, tidy PWM routing for flicker-free control.

• Smart modules & embedded nodes — radio or transceiver companion MCU with low EMI footprint.

• Compact industrial I/O slices — dense GPIO, quick SPI/I²C busing, and robust thermal return in tight bays.

Three quick features

1. Leadless WQFN + exposed pad for solid grounding and heat spreading.

2. Family low-power + fast wake to balance responsiveness and battery life.

3. 12-bit ADC to 1.5 Msps for rapid, repeatable sampling in small form factors.

Layout & assembly guidance (WQFN-specific)

• Pad and plane strategy: treat the exposed pad as primary GND; stitch with a via array into the ground plane directly under the device to reduce return impedance for ADC and timers.

• Stencil & paste: use a window-pane stencil on the exposed pad (≈50–70% paste coverage) to avoid float/voids; perimeter pads should be solder-mask-defined for consistent fillets.

• Via-in-pad: if needed for density, use filled/capped microvias on the exposed pad; otherwise, tent vias to control wicking.

• Signal integrity: fan-out SPI/clock lines on the shortest escape layer; keep them away from ADC inputs and VREF routes.

• Thermal: tie heat sources (drivers/LED FETs) into the same ground island so the exposed pad acts as a shared spreader, then isolate analog grounds locally before a single-point tie to the pad.

Mixed-signal partitioning (do more in less space)

• ADC/VREF hygiene: dedicate a quiet polygon around analog pins; keep high-di/dt PWM edges and chip-selects off that boundary.

• PWM timing: use the advanced timer for center-aligned PWM or higher resolution dimming; place gate drivers adjacent to reduce loop area.

• Reference options: select 1.4 V VREF for low-range, low-noise sensors; 2.5 V for wider span without external references.

Power & firmware strategy

• Event-driven firmware: idle in STANDBY, wake from GPIO/RTC/ADC thresholds; return to sleep quickly.

• Shelf mode: enable SHDN (~200 nA) for storage/shipping.

• Throughput budgeting: ~87 µA/MHz → ≈2.1 mA @ 24 MHz baseline; gate clocks and use DMA for ADC bursts to shorten active windows.

How it differs from your other package choices

• vs. SOT-16 (SDYYR): lower z-height and better ground impedance for ADC/EMI; requires tighter assembly control (no gull-wing leads).

• vs. VSSOP-20 (SDGS20R): smaller profile and improved return paths; VSSOP is easier to AOI/rework but taller.

• vs. 8-pin SOT/WSON (SDDFR/SDSGR): far more I/O and cleaner partitioning; WSON is also low profile, but WQFN-20 offers significantly richer pinout.

Summary

If your design is height-constrained but needs real I/O breadth, clean ADC performance, and efficient thermal/EMI returns, MSPM0C1104SRUKR (WQFN-20) is the sweet spot. You get the smallest profile with an exposed pad for grounding and heat—exactly what dense control boards, sensor hubs, and sleek smart modules need.