Embedded Processors and Controllers
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Microchip PIC32MX564F128L-I/PT RISC Microcontroller, 32-Bit, FLASH, PIC32 CPU, 80MHz, CMOS, PQFP100
Microchip PIC32MX775F512L-80I/PF 32 Bit MCU 512KB Flash 64KB RAM 80 MHz 100 Pin USB ENET 2 CAN
Microchip PIC32MZ1024EFG144-I/PL Secure MCU 32bit PIC32 PIC RISC 1MB Flash 3.3V Automotive 144-Pin LQFP Tray
- Anti-Fuse OTP Security – Permanent programming resistant to radiation & tampering
- 250 MHz High-Speed Logic – Supports DSP, motor control, and real-time processing
- Ultra-Low Static Power – Ideal for battery-backed & power-sensitive designs
- VSSOP-20 = best I/O density in a small outline — practical room for PWM, serial, and multi-channel ADC.
- High-speed 12-bit ADC suitable for fast sampling and control loops.
- Protocol-rich serial (UART/I²C/SPI) in a budget MCU for easy peripheral hookup.
- Middle-ground pin count in a slim SOT body—enough I/O for “real” designs without jumping to QFN.
- Family 24-MHz precision oscillator (crystal-less in many cases) for simpler BOM and height.
- Flexible internal VREF (1.4 V / 2.5 V) to match sensor ranges and improve ADC repeatability.
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Leadless WQFN + exposed pad for solid grounding and heat spreading.
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Family low-power + fast wake to balance responsiveness and battery life.
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12-bit ADC to 1.5 Msps for rapid, repeatable sampling in small form factors.
- TSSOP-20 with ~17 GPIO for practical wiring and debugging.
- Nine 12-bit ADC channels (to 1.5 Msps) for multi-sensor builds.
- Same low-power DNA and software feel as MSPM0C110x for easy migration.
NXP Semiconductors LPC1113FBD48/301,151 MCU 32-bit LPC1100 ARM Cortex M0 RISC 24KB Flash 3.3V 48-Pin LQFP Tray
- Dual-core performance with ample SRAM – Two M0+ cores up to 133 MHz and 264 kB multi-bank SRAM keep control loops, UI, and I/O running smoothly in parallel.
- Programmable I/O (PIO) – Two PIO blocks (eight state machines) provide cycle-accurate pin control to emulate or extend peripherals like UART, video, or bespoke serial protocols—without extra ICs.
- Rich connectivity including USB 1.1 – Integrated full-speed USB with device/host modes, two each of UART/SPI/I²C, 16 PWM channels, 12-bit ADC, and 30 GPIO unlock a wide array of products with minimal components.
- Dual-Core, Dual-Architecture: Choose between Arm Cortex-M33 or RISC-V cores (both at 150MHz).
- Advanced Security: TrustZone, SHA-256 accelerator, OTP key storage, and glitch detection for tamper resistance.
- Rich I/O Capabilities: 48 GPIOs, 12 PIO state machines, and support for 16MB external flash/PSRAM.
- Onboard Memory: 520KB SRAM + 2MB stacked flash (RP2354B variant).
- Comprehensive Peripherals: USB 1.1 Host/Device, 24 PWM channels, 8 ADC inputs, and more.
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Quad-core Cortex-A55 up to 2.0 GHz for responsive, power-efficient embedded compute.
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1 TOPS NPU + Mali-G52 GPU for edge AI and modern graphics/compute APIs.
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4Kp60 decode, 1080p60 encode, and multi-display support for rich media scenarios.
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Quad-core Cortex-A55 up to 2.0 GHz for responsive, power-efficient embedded compute.
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1 TOPS NPU + Mali-G52 GPU for edge AI and modern graphics/compute APIs.
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4Kp60 decode, 1080p60 encode, and multi-display support for rich media scenarios.
- 8-core 8 nm CPU with 6 TOPS NPU: Flagship compute and AI acceleration for demanding edge workloads.
- 8K-class multimedia engine: Decode 8K60, encode 8K30, and drive multi-display setups up to 8K@60.
- Rich, modern I/O: PCIe 3.0, USB 3.1, SATA 3.0, GbE, and flexible camera/display interfaces.
- 6 TOPS on-chip NPU for private, low-latency AI at the edge.
- 8K60 decode + 8K30 encode for premium playback, recording, and signage.
- Dual 48MP ISP with HDR/3DNR for multi-camera vision systems.
- Industrial-Grade Robustness – Operates at 125°C junction temperature with ESD >4kV
- Hardware Crypto – 96-bit UID for secure boot/authentication
- Single-Cycle I/O – Bit-banding accelerates GPIO toggling (<15 ns pulse width)
- High-Speed Performance: Arm Cortex-M33 up to 250 MHz with DSP and FPU for precise real-time control.
- Advanced Security: Hardware HASH engine, TRNG, and tamper protection ensure data integrity.
- Industrial-Grade Reliability: ECC memories, wide temperature range, and robust LQFP48 package.
STM32H743ZIT6 is a high-performance 32-bit microcontroller based on the ARM Cortex-M7 core, operating at clock speeds up to 480 MHz. It integrates large on-chip memory, advanced peripheral interfaces, and hardware acceleration, making it suitable for compute-intensive embedded applications in industrial, networking, and real-time control systems.
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Tiny 8-pin SOT footprint with integrated 12-bit ADC.
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Accurate 24 MHz internal oscillator; no crystal needed.
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Multi-mode low-power design down to 200 nA shutdown.
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WSON-8 for slim boards & thermal contact — exposed pad helps spread heat and stiffen the mount.
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Fast 12-bit ADC with internal/external reference flexibility.
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Crystal-less 24 MHz in many designs, minimizing BOM and height.
The Xilinx Virtex-7 VC707 Evaluation Kit features the XC7VX485T FPGA with 40Gb/s serial bandwidth, PCIe Gen2x8, DDR3, and FMC expansion. Ideal for high-performance DSP, networking, and embedded development.
Key Features:
✅ XC7VX485T-2FFG1761C FPGA – High-speed GTX transceivers (16Gbps) ✅ 1GB DDR3 + PCIe Gen2x8 – Advanced memory & interface support ✅ FMC HPC Connectors – Expand with mezzanine cards for custom I/O
The Xilinx XC2C256-6FTG256C is a low-power, high-performance CPLD with 256 macrocells, 5.7ns pin-to-pin delays, and multi-voltage I/O (1.5V–3.3V). Ideal for battery-powered and high-speed logic designs.
Key Features:
✅ Ultra-Low Power – 13μA quiescent current, DataGATE for dynamic power reduction ✅ High-Speed Logic – 5.7ns pin-to-pin delay, DualEDGE flip-flops for 2x efficiency ✅ Flexible I/O Banking – Supports LVCMOS, LVTTL, SSTL, HSTL (1.5V–3.3V)
The Xilinx XC2VP4-5FGG256I FPGA features 4 RocketIO transceivers, a PowerPC CPU core, and 6,768 logic cells—ideal for 5G, AI, and industrial applications. View specs, pricing, and alternatives at FPGAkey.
Key Features:
✅ Multi-Gigabit Transceivers: 4 RocketIO for high-speed serial comms (up to 3.125Gbps) ✅ Integrated PowerPC 405 CPU: RISC-based embedded processing ✅ High-Density Logic: 6,768 cells, 752 CLBs, and 516Kb RAM for complex designs
The Xilinx XC3S1500-4FGG456C FPGA delivers 1.5M logic gates, 316 I/O, and DSP slices—ideal for industrial, automotive, and video processing. View datasheets, pricing, and alternatives.
Key Features:
✅ High Logic Density – 1.5M gates, 1,542 logic cells ✅ Rich I/O Options – 316 user I/O, supports LVCMOS, LVTTL, HSTL, SSTL ✅ DSP & RAM Resources – 1,728Kb BRAM, embedded multipliers
The Xilinx XC3S200A-4FTG256I FPGA offers 200K logic gates, 128 I/O pins, and ultra-low power (0.35mW) - ideal for aerospace, automotive & IoT. Supports VHDL/Verilog.
Key Features
✅ Ultra-Low Power (0.35mW Static) – 90nm process, ideal for battery-powered & rugged applications. ✅ High-Speed I/O & DSP Support – 667MHz operation with embedded multipliers for signal processing. ✅ Multi-Voltage Compatibility (1.2V–3.3V) – Flexible I/O standards (LVCMOS, LVTTL, HSTL, SSTL).
The Xilinx XC5VLX30T-1FF665I FPGA delivers 30K logic cells, 3.75Gbps GTP transceivers, and 550MHz DSP slices—ideal for 5G, aerospace, and high-performance computing. Supports PCIe & Ethernet MAC.
Key Features
✅ 3.75Gbps RocketIO GTP Transceivers – High-speed serial links for PCIe, SATA, and 5G backhaul. ✅ 550MHz DSP48E Slices – 25×18 multipliers + 48-bit accumulators for real-time signal processing. ✅ Advanced 65nm Low-Power Design – 1V core voltage with integrated thermal/power monitoring.
The Xilinx XC6VLX130T-1FFG1156C (Virtex-6 LXT) FPGA features 131,072 logic cells, 6.5Gbps GTX transceivers, and hardened PCIe/Ethernet IP for high-bandwidth applications in networking, aerospace, and industrial automation.
Key Features
✅ 6.5Gbps RocketIO GTX Transceivers – Supports PCIe Gen2, SATA, 10G Ethernet, and CPRI. ✅ High-Capacity Logic Fabric – 131K logic cells with 6-input LUTs for complex designs. ✅ Power-Optimized 40nm Architecture – 1.0V core voltage with triple-oxide technology for reduced leakage.
The Xilinx XC6VLX240T-2FFG784I (Virtex®-6 LXT) FPGA delivers 241,152 logic cells, 15.3Mb RAM, and 6.6Gbps GTX transceivers for high-bandwidth applications in 5G, AI, and industrial systems. Supports PCIe, Ethernet, and rugged -40°C to 100°C operation.
Key Features
✅ High-Density Logic Fabric: 241K logic cells with 6-input LUTs for complex designs. ✅ Ultra-Fast Serial Connectivity: 6.6Gbps GTX transceivers (PCIe Gen2/3, 10G Ethernet). ✅ Extended Temperature Range: -40°C to +100°C for harsh environments.
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DSBGA-8 footprint for the smallest prototypes and z-height budgets.
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Full MSPM0C1104 feature set (24-MHz M0+, 12-bit ADC, UART/I²C/SPI) in a minuscule package.
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Explicit X-device status to de-risk production—prototype now, change package later.