Showing 2491–2509 of 2509 results
- Efficient Isolation with Moderate CTR: The 63-125 % CTR bin balances input drive and cost, suitable for many mainstream isolation tasks.
- High Isolation Voltage: Like the rest of the series, this part provides 3750 VRMS isolation, ensuring safety between high-voltage and low-voltage domains.
- Space-Saving SSOP-4 Package: Enables use in compact PCB footprints, fitting well in modern dense electronic designs.
Key Features
🔥 Ultra-High Airflow: 988.81 CFM for large-scale ventilation & equipment cooling. ⚙️ Rugged Construction: Die-cast aluminum housing + ball bearings for 24/7 durability. 🛡️ IP44 Protection: Resists dust & splashes in harsh environments (industrial/machine use).- Temperature-compensated charging via integrated 100 kΩ NTC for longer battery life.
- Built-in protection with 2×25 A fuses and support for parallel connection to scale capacity.
- Cabinet-friendly size, plug-in wiring, and wide operating temperatures for fast deployment.
Key Features:
✅ XC7VX485T-2FFG1761C FPGA – High-speed GTX transceivers (16Gbps) ✅ 1GB DDR3 + PCIe Gen2x8 – Advanced memory & interface support ✅ FMC HPC Connectors – Expand with mezzanine cards for custom I/OKey Features:
✅ Ultra-Low Power – 13μA quiescent current, DataGATE for dynamic power reduction ✅ High-Speed Logic – 5.7ns pin-to-pin delay, DualEDGE flip-flops for 2x efficiency ✅ Flexible I/O Banking – Supports LVCMOS, LVTTL, SSTL, HSTL (1.5V–3.3V)Key Features:
✅ Multi-Gigabit Transceivers: 4 RocketIO for high-speed serial comms (up to 3.125Gbps) ✅ Integrated PowerPC 405 CPU: RISC-based embedded processing ✅ High-Density Logic: 6,768 cells, 752 CLBs, and 516Kb RAM for complex designsKey Features:
✅ High Logic Density – 1.5M gates, 1,542 logic cells ✅ Rich I/O Options – 316 user I/O, supports LVCMOS, LVTTL, HSTL, SSTL ✅ DSP & RAM Resources – 1,728Kb BRAM, embedded multipliersKey Features
✅ Ultra-Low Power (0.35mW Static) – 90nm process, ideal for battery-powered & rugged applications. ✅ High-Speed I/O & DSP Support – 667MHz operation with embedded multipliers for signal processing. ✅ Multi-Voltage Compatibility (1.2V–3.3V) – Flexible I/O standards (LVCMOS, LVTTL, HSTL, SSTL).Key Features
✅ 3.75Gbps RocketIO GTP Transceivers – High-speed serial links for PCIe, SATA, and 5G backhaul. ✅ 550MHz DSP48E Slices – 25×18 multipliers + 48-bit accumulators for real-time signal processing. ✅ Advanced 65nm Low-Power Design – 1V core voltage with integrated thermal/power monitoring.Key Features
✅ 6.5Gbps RocketIO GTX Transceivers – Supports PCIe Gen2, SATA, 10G Ethernet, and CPRI. ✅ High-Capacity Logic Fabric – 131K logic cells with 6-input LUTs for complex designs. ✅ Power-Optimized 40nm Architecture – 1.0V core voltage with triple-oxide technology for reduced leakage.Key Features
✅ High-Density Logic Fabric: 241K logic cells with 6-input LUTs for complex designs. ✅ Ultra-Fast Serial Connectivity: 6.6Gbps GTX transceivers (PCIe Gen2/3, 10G Ethernet). ✅ Extended Temperature Range: -40°C to +100°C for harsh environments.-
DSBGA-8 footprint for the smallest prototypes and z-height budgets.
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Full MSPM0C1104 feature set (24-MHz M0+, 12-bit ADC, UART/I²C/SPI) in a minuscule package.
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Explicit X-device status to de-risk production—prototype now, change package later.
