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- All-in-one USB — single cable for power, flashing, debug, and backchannel UART.
- Instant I/O — built-in red LED and user button for immediate bring-up and demos.
- BoosterPack-ready — standard 20-pin headers to snap in sensors, radios, and displays fast.
- FRAM Memory: 32KB nonvolatile storage with 10^15 write cycles and 100ns write speed.
- Ultra-Low-Power Modes: Measure down to µA with 32.768kHz crystal for LPM sleep states.
- BoosterPack™ Ready: 40-pin headers support 100+ plug-in modules (wireless, displays, etc.).
- Integrated Debugging: eZ-FET probe enables programming + EnergyTrace power profiling.
- Sensor Hub: Includes ambient light sensor + Grove connector (P1.1/P1.4) for Seeed Studio modules.
- Industrial Temperature Range (-40°C to +85°C) for harsh environment operation
- Higher Output Drive Capacity (±6mA at 5V) vs basic 74HC logic family
- Robust ESD Protection (2000V HBM) for improved field reliability
- Through-hole DIP package - Ideal for prototyping and repairs
- 15 LSTTL load drive capability - Strong output for direct loads
- Cascadable serial output - Expand to unlimited bits
- 60ns Access Time – Faster performance than 70ns variants for demanding applications.
- 256K x 16-Bit Architecture – Efficient 16-bit memory handling for older systems.
- Wider Temperature Range: Operates reliably from 0°C to 70°C.
- 70ns Access Time – Optimized for fast read/write operations in high-performance systems.
- 256K x 16-Bit Organization – Balances memory density with efficient data handling.
- 5V Single Supply Voltage – Compatible with legacy industrial and embedded devices.
Vishay MAL218497557E3 aluminum polymer capacitor offers 100μF/20V in compact 8×8×11.7mm SMD package with ultra-low 35mΩ ESR and 4.21A ripple current.
- Ultra-low ESR (35mΩ) for high efficiency
- High ripple current (4.21A) handles power demands
- Extended 2000-hour lifespan at 105°C
- Ultra-Efficient: Just 720mV Vf @ 2A reduces thermal stress
- Automotive Tough: AEC-Q101 certified (-55°C to +175°C operation)
- Space-Smart: DO-219AB (2.9×1.9mm) fits high-density PCBs
The ebm-papst W2E250-DB13-51 is a 280mm square AC axial fan delivering 988.81 CFM airflow at 2650 RPM. Features IP44 protection, ball bearings, and 180W power for industrial cooling. Explore the full W2E250 series for HVAC, heavy machinery, and server cooling solutions.
Key Features
🔥 Ultra-High Airflow: 988.81 CFM for large-scale ventilation & equipment cooling. ⚙️ Rugged Construction: Die-cast aluminum housing + ball bearings for 24/7 durability. 🛡️ IP44 Protection: Resists dust & splashes in harsh environments (industrial/machine use).
The Xilinx Virtex-7 VC707 Evaluation Kit features the XC7VX485T FPGA with 40Gb/s serial bandwidth, PCIe Gen2x8, DDR3, and FMC expansion. Ideal for high-performance DSP, networking, and embedded development.
Key Features:
✅ XC7VX485T-2FFG1761C FPGA – High-speed GTX transceivers (16Gbps) ✅ 1GB DDR3 + PCIe Gen2x8 – Advanced memory & interface support ✅ FMC HPC Connectors – Expand with mezzanine cards for custom I/O
The Xilinx XC2C256-6FTG256C is a low-power, high-performance CPLD with 256 macrocells, 5.7ns pin-to-pin delays, and multi-voltage I/O (1.5V–3.3V). Ideal for battery-powered and high-speed logic designs.
Key Features:
✅ Ultra-Low Power – 13μA quiescent current, DataGATE for dynamic power reduction ✅ High-Speed Logic – 5.7ns pin-to-pin delay, DualEDGE flip-flops for 2x efficiency ✅ Flexible I/O Banking – Supports LVCMOS, LVTTL, SSTL, HSTL (1.5V–3.3V)
The Xilinx XC2VP4-5FGG256I FPGA features 4 RocketIO transceivers, a PowerPC CPU core, and 6,768 logic cells—ideal for 5G, AI, and industrial applications. View specs, pricing, and alternatives at FPGAkey.
Key Features:
✅ Multi-Gigabit Transceivers: 4 RocketIO for high-speed serial comms (up to 3.125Gbps) ✅ Integrated PowerPC 405 CPU: RISC-based embedded processing ✅ High-Density Logic: 6,768 cells, 752 CLBs, and 516Kb RAM for complex designs
The Xilinx XC3S1500-4FGG456C FPGA delivers 1.5M logic gates, 316 I/O, and DSP slices—ideal for industrial, automotive, and video processing. View datasheets, pricing, and alternatives.
Key Features:
✅ High Logic Density – 1.5M gates, 1,542 logic cells ✅ Rich I/O Options – 316 user I/O, supports LVCMOS, LVTTL, HSTL, SSTL ✅ DSP & RAM Resources – 1,728Kb BRAM, embedded multipliers
The Xilinx XC3S200A-4FTG256I FPGA offers 200K logic gates, 128 I/O pins, and ultra-low power (0.35mW) - ideal for aerospace, automotive & IoT. Supports VHDL/Verilog.
Key Features
✅ Ultra-Low Power (0.35mW Static) – 90nm process, ideal for battery-powered & rugged applications. ✅ High-Speed I/O & DSP Support – 667MHz operation with embedded multipliers for signal processing. ✅ Multi-Voltage Compatibility (1.2V–3.3V) – Flexible I/O standards (LVCMOS, LVTTL, HSTL, SSTL).
The Xilinx XC5VLX30T-1FF665I FPGA delivers 30K logic cells, 3.75Gbps GTP transceivers, and 550MHz DSP slices—ideal for 5G, aerospace, and high-performance computing. Supports PCIe & Ethernet MAC.
Key Features
✅ 3.75Gbps RocketIO GTP Transceivers – High-speed serial links for PCIe, SATA, and 5G backhaul. ✅ 550MHz DSP48E Slices – 25×18 multipliers + 48-bit accumulators for real-time signal processing. ✅ Advanced 65nm Low-Power Design – 1V core voltage with integrated thermal/power monitoring.
The Xilinx XC6VLX130T-1FFG1156C (Virtex-6 LXT) FPGA features 131,072 logic cells, 6.5Gbps GTX transceivers, and hardened PCIe/Ethernet IP for high-bandwidth applications in networking, aerospace, and industrial automation.
Key Features
✅ 6.5Gbps RocketIO GTX Transceivers – Supports PCIe Gen2, SATA, 10G Ethernet, and CPRI. ✅ High-Capacity Logic Fabric – 131K logic cells with 6-input LUTs for complex designs. ✅ Power-Optimized 40nm Architecture – 1.0V core voltage with triple-oxide technology for reduced leakage.
The Xilinx XC6VLX240T-2FFG784I (Virtex®-6 LXT) FPGA delivers 241,152 logic cells, 15.3Mb RAM, and 6.6Gbps GTX transceivers for high-bandwidth applications in 5G, AI, and industrial systems. Supports PCIe, Ethernet, and rugged -40°C to 100°C operation.
Key Features
✅ High-Density Logic Fabric: 241K logic cells with 6-input LUTs for complex designs. ✅ Ultra-Fast Serial Connectivity: 6.6Gbps GTX transceivers (PCIe Gen2/3, 10G Ethernet). ✅ Extended Temperature Range: -40°C to +100°C for harsh environments.
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DSBGA-8 footprint for the smallest prototypes and z-height budgets.
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Full MSPM0C1104 feature set (24-MHz M0+, 12-bit ADC, UART/I²C/SPI) in a minuscule package.
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Explicit X-device status to de-risk production—prototype now, change package later.