ESP32-S3-WROOM-2-N32R16V ESPRESSIF ESP32-S3-WROOM-2-N32R16V Wi-Fi & Bluetooth LE Module

  • 32 MB Octal flash + 16 MB Octal PSRAM for code, assets, and AI buffers.
  • Dual-core LX7 up to 240 MHz with neural-network and signal-processing acceleration in ESP32-S3 silicon.
  • 2.4 GHz Wi-Fi (to 150 Mbps) + BLE 5 with coexistence on a single PCB antenna.

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ESP32-S3-WROOM-2-N32R16V RF and Wireless Module overview, key specifications, applications

The ESPRESSIF ESP32-S3-WROOM-2-N32R16V is a compact, production-ready wireless module that pairs 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® Low Energy 5 on top of Espressif’s dual-core Xtensa® LX7 SoC. Clocked up to 240 MHz and equipped here with 32 MB Octal SPI flash and 16 MB Octal PSRAM, this N32R16V variant gives you generous code space, fast XIP bandwidth, and headroom for ML at the edge, audio, vision, and rich UI workloads. It integrates a 40 MHz crystal and on-board PCB antenna inside a robust, easy-to-mount package, while exposing 33 GPIOs and a long list of digital and analog peripherals including USB 2.0 OTG (full-speed), LCD/Camera interface, SPI/I²C/I²S, SD/MMC host, TWAI® (CAN 2.0), LEDC, MCPWM, RMT, ADC, touch sensing, and temperature sensor.

Built for connected products, the module delivers 802.11n rates up to 150 Mb/s, supports AMPDU/AMSDU aggregation and 0.4 µs GI, and includes an internal Wi-Fi/BLE coexistence mechanism that shares the same antenna for reliable performance. On the BLE side, it supports 1 Mb/s and 2 Mb/s PHYs plus long-range 125 kb/s and 500 kb/s coded PHYs, advertising extensions, and multiple advertising sets—ideal for gateways, sensors, wearables, and smart appliances. (See the Features and RF tables in the datasheet.)

Power is straightforward: a single 3.0–3.6 V rail, with recommended 3.3 V nominal operation. Typical low-power modes include Modem-sleep, Light-sleep, and Deep-sleep (as low as single-digit microamps on RTC-only), enabling battery-friendly designs. For robust industrial deployment, the module is qualified for –40 °C to +65 °C ambient, and Espressif provides RF/green certifications, ESD ratings, MSL-3 handling guidance, and a detailed reflow profile to streamline manufacturing. (See Electrical Characteristics, Current Consumption, and Product Handling.)

Espressif’s ESP-IDF and rich ecosystem (AT firmware, examples, devkits, and tooling) shorten your time-to-market for everything from smart home HMI and voice to video streaming and AIoT. A clear block diagram and pin layout help with bring-up, while module dimensions and a recommended PCB land pattern simplify footprinting and antenna keep-out on your base board. (See pages with the block diagram, pinout, dimensions, and land-pattern.)

Specifications

The following summarizes the official datasheet information for the ESP32-S3-WROOM-2-N32R16V variant, complemented by key figures from the Electrical, RF, Pins, and Mechanical sections. For visual reference, see the block diagram (p. 9), pin layout (p. 10), RF tables (pp. 33–39), current consumption (pp. 30–31), dimensions (p. 42), and land pattern (p. 43) in the datasheet.

Parameter Details
Module ESPRESSIF ESP32-S3-WROOM-2-N32R16V (ESP32-S3 series) with on-board PCB antenna. Variant provides 32 MB Octal flash + 16 MB Octal PSRAM. See Series Comparison.
SoC / CPU ESP32-S3R8V/R16V family with Xtensa® dual-core 32-bit LX7, up to 240 MHz, single-precision FPU; ultra-low-power coprocessor for always-on sensing.
On-chip memory 384 KB ROM, 512 KB SRAM, 16 KB RTC SRAM (SoC).
External memory (on module) Flash up to 32 MB (Octal) / PSRAM up to 16 MB (Octal); N32R16V specifically: 32 MB flash + 16 MB PSRAM. (Note: enabling PSRAM ECC reduces usable PSRAM by 1/16 but increases max ambient to 85 °C.)
Wireless 2.4 GHz Wi-Fi (802.11b/g/n), PHY to 150 Mb/s, AMPDU/AMSDU, 0.4 µs GI, 2412–2484 MHz channel range; Bluetooth LE 5 with 125/500 kb/s, 1 Mb/s, 2 Mb/s, advertising extensions, multi-set ads, coexistence with Wi-Fi via shared antenna.
Typical Wi-Fi TX power Up to 20.5 dBm @ 802.11b 1/11 Mb/s; 18 dBm @ 802.11g 54 Mb/s; 17.5 dBm @ 802.11n HT20 MCS7; 17 dBm @ HT40 MCS7. See TX power & EVM tables.
Wi-Fi RX sensitivity (typ.) Down to –98.2 dBm (11b 1 Mb/s); –93 dBm (11n HT20 MCS0); –74.2 dBm (11n HT20 MCS7). See RX tables.
BLE RF Center freq. 2402–2480 MHz; TX power range –24 to +20 dBm (typical programmable). See BLE TX/RX characteristic tables.
Peripherals (highlights) USB 2.0 OTG (FS) with integrated PHY; USB-Serial/JTAG (CDC-ACM + JTAG); SPI0/1 (Octal, SDR/DDR), SPI2/3 (master/slave), LCD/Camera (8–16-bit, up to 40 MHz), SD/MMC host, I²C ×2, I²S ×2, UART ×3, LEDC PWM ×8, MCPWM ×2, RMT, PCNT, TWAI® (CAN 2.0), SAR ADC ×2 (12-bit, 20 channels), touch sensor ×14, temperature sensor, timers, GDMA.
GPIOs / pins 33 GPIOs exposed; 41 pins total (including power/GND/EPAD). Note GPIO47/48 operate at 1.8 V (VDD_SPI domain). See pin table and note.
Boot & strapping Boot via SPI flash (default) or Joint Download Boot (USB-Serial-JTAG / USB-OTG / UART); strapping pins on GPIO0, GPIO45, GPIO46, GPIO3 with default pull resistors; timing/hold constraints detailed in the boot section.
Voltage / power Supply 3.0–3.6 V (typ. 3.3 V); IVDD capability ≥0.5 A recommended. EN pin enables/disables chip (do not float; RC delay (≈10 kΩ/1 µF) recommended).
DC I/O VIH ≈ 0.75×VDD to VDD+0.3; VIL ≤ 0.25×VDD; source/sink currents (PAD_DRIVER=3): ~40 mA/28 mA; internal pull-ups/downs ≈45 kΩ (typ.).
Current consumption (examples) Active RX ≈ 95–97 mA (HT20/HT40); TX up to ~355 mA (11b 1 Mb/s @20.5 dBm); Modem-sleep 13–92 mA depending on clock/core activity; Light-sleep ~240 µA (add PSRAM quiescent if present); Deep-sleep ~7–8 µA (RTC). See tables for full matrix.
Operating temp. –40 °C to +65 °C ambient for the module (ambient = environment just outside the can). Enabling PSRAM ECC can extend max ambient to 85 °C (with memory size trade-off).
Antenna On-board PCB antenna (keep-out zone on carrier PCB per hardware guidelines).
Clock source 40 MHz crystal on module.
Mechanical Body approx. 25.5 × 18.0 × 3.1 mm; detailed pad map and keep-out; recommended PCB land pattern and 3D STEP available.
Certifications & tests RF certification references; RoHS/REACH; reliability tests (HTOL/HTSL/uHAST/TCT/ESD).
ESD / Handling HBM ±2 kV, CDM ±500 V; MSL-3 storage/reflow; single reflow profile: peak 235–250 °C (SAC305). Avoid ultrasonic vibration exposure.
Development ESP-IDF Programming Guide, examples, PCNs/advisories, forums, and product selector links provided by Espressif.

Design notes:
• Follow the antenna keep-out guidance and place the module at a board edge to minimize ground detuning. 
• If you use USB-OTG with the internal PHY, D+ and D– are multiplexed on GPIO19/20; external PHY pin mappings are also defined. 
• Because GPIO47/48 are on the 1.8 V domain (VDD_SPI=1.8 V on S3R8V/R16V), level shifting may be required in mixed-voltage designs.

ESP32-S3-WROOM-2-N32R16V Applications

The ESP32-S3-WROOM-2-N32R16V RF and Wireless  module targets modern AIoT devices that blend rich user interaction with low power and strong connectivity:

  • Smart home & appliances: Matter/Thread bridges (via Wi-Fi backhaul), voice-assisted control panels, robot vacuums, AC controllers, lighting hubs, smart plugs, and high-end thermostats.

  • Consumer audio & HMI: USB speakers (FS), BLE audio accessories (control), touch keypads, RGB lighting with smooth fades (LEDC), I²S microphones/codecs, and LCD-based interfaces.

  • Cameras & vision: Parallel DVP camera input (up to 16-bit @ 40 MHz), face detection/recognition on-device, streaming over Wi-Fi.

  • Industrial & commercial: TWAI® (CAN 2.0) gateways, SD-card data loggers, barcode/RFID terminals (USB device + Wi-Fi), POS, vending, and sensor hubs with Modem-sleep/Light-sleep duty cycling.

  • Healthcare & wearables: BLE-enabled data collection, proximity/touch interfaces, and power-optimized telemetry using Deep-sleep.

Espressif highlights AI-centric use cases such as wake-word/speech command recognition and image recognition—well matched to this N32R16V memory configuration.

Why choose the ESP32-S3-WROOM-2-N32R16V configuration?

  1. Headroom for complex apps – 32 MB flash accommodates RTOS, connectivity stacks, over-the-air updaters, and UI/ML assets (fonts, models, graphics), while 16 MB PSRAM sustains frame buffers, audio rings, and tensor arenas without aggressive tuning.

  2. Throughput + peripherals – 802.11n PHY to 150 Mb/s, Octal SPI/OPI, and DMA-enabled peripherals (I²S, SPI2/3, SD/MMC) keep data moving, whether you’re reading cameras, streaming audio, or logging to SD.

  3. USB built-in – Full-speed USB-OTG and a USB-Serial/JTAG device make flashing, logging, field updates, and debugging hassle-free—no extra bridge ICs required.

What the official diagrams show

  • The block diagram shows the ESP32-S3 SoC, Octal flash/PSRAM over OPI/QPI, 40 MHz crystal, RF matching network, EN and GPIO break-outs, and the PCB antenna path. This confirms the on-module integration that simplifies your base board.

  • The pin layout illustrates the 41-pad footprint, keep-out zone beneath the antenna, and the placement of UART0 (TXD0/RXD0), JTAG (MTCK/MTDI/MTMS/MTDO), and high-density GPIOs around the perimeter.

  • The dimensions detail overall size ~25.5×18.0×3.1 mm and pad pitch/diameters for accurate mechanical modeling. A matching recommended land pattern is provided to speed PCB work and ensure solder joint quality.

Practical power & RF notes

  • Currents: Plan your supply for peak TX (e.g., ~355 mA @ 11b 1 Mb/s) and margin for inrush; in RX you’ll see ~95–97 mA. Sleep currents reach the µA range; add PSRAM quiescent current when present.

  • Transmit levels: Typical Wi-Fi TX power tops ~20.5 dBm in 11b; BLE TX range is –24 to +20 dBm. Use proper layout, ground, and keep-out to achieve datasheet RF performance.

  • Environment: Ambient –40 °C to +65 °C is specified for the module; if you enable PSRAM ECC, usable ambient can rise to 85 °C (with a small PSRAM capacity trade-off).

  • USB routing: If using the internal FS PHY, route D+ / D- from GPIO20/19 with controlled impedance and short stubs; for external PHY, follow the ALT pin map given in the USB sections.

  • Antenna: Respect the keep-out and avoid copper beneath the antenna area on all layers; board-edge placement generally yields the best results. See Module Placement guidelines.

Comparison of the ESP32-S3-WROOM-2 variants

Espressif lists multiple ESP32-S3-WROOM-2 RF Transceiver Modules and Modems variants. The N32R16V you’re viewing is the memory-max configuration with 32 MB Octal flash and 16 MB Octal PSRAM; earlier 16 MB/8 MB options are noted EOL in recent revisions.

Ordering code Flash (Octal) PSRAM (Octal) Status Ambient temp. Module size Notes
ESP32-S3-WROOM-2-N32R16V 32 MB 16 MB Active –40 to +65 °C 18.0 × 25.5 × 3.1 mm New variant added in v1.4 of the datasheet. Enabling PSRAM ECC raises max ambient to 85 °C but reduces usable PSRAM by 1/16.
ESP32-S3-WROOM-2-N32R8V 32 MB 8 MB EOL –40 to +65 °C 18.0 × 25.5 × 3.1 mm Marked End of Life in revision history.
ESP32-S3-WROOM-2-N16R8V 16 MB 8 MB EOL –40 to +65 °C 18.0 × 25.5 × 3.1 mm Marked End of Life in revision history.

Common to all ESP32-S3-WROOM-2 variants (from the same table/section):
• Built around ESP32-S3 SoCs (either ESP32-S3R8V or ESP32-S3R16V inside the module).
• PCB antenna; single 3.0–3.6 V supply; same mechanical envelope.
• If PSRAM ECC is enabled, max ambient can be 85 °C with the 1/16 PSRAM size trade-off.

Datasheet source and table location: “1.2 Series Comparison – Table 1: ESP32-S3-WROOM-2 Series Comparison”, plus revision history noting the new N32R16V and EOL status of N16R8V/N32R8V.

Package contents

  • Module with integrated 40 MHz crystal, Octal flash/PSRAM, PCB antenna

  • 41-pad castellated interface (33 GPIOs accessible) + ground EPAD (optional solder for thermal)

  • Official documentation: datasheet, hardware design guide, TRM, IDF programming guide, PCNs/advisories, and certificates.

Conclusion

If you need a single, compact, and memory-rich Wi-Fi + BLE module with USB built in, camera/LCD capability, CAN-bus, and enough horsepower for speech/vision ML—the ESP32-S3-WROOM-2-N32R16V is a pragmatic choice that balances performance, integration, and manufacturability from concept to volume.

Specification: ESPRESSIF ESP32-S3-WROOM-2-N32R16V Wi-Fi & Bluetooth LE Module

Brand

Xilinx / AMD

IC Type

Field-Programmable Gate Array

ESPRESSIF ESP32-S3-WROOM-2-N32R16V Wi-Fi & Bluetooth LE Module
ESPRESSIF ESP32-S3-WROOM-2-N32R16V Wi-Fi & Bluetooth LE Module
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